·上一文章:国产集成电路命名方法
·下一文章:集成电路标准封装(s开关头)
外形图 |
封装说明 | |
![]() |
TQFP 100L
详细规格 | |
![]() |
TSOP Thin Small Outline PACkage | |
![]() |
TSSOP or TSOP II Thin Shrink Outline Package | |
![]() |
LAMINATE TCSP 20L Chip Scale Package 详细规格 | |
![]() |
LAMINATE UCSP 32L Chip Scale Package 详细规格 | |
![]() |
uBGA MICro Ball Grid Array | |
![]() |
uBGA Micro Ball Grid Array | |
![]() |
VL Bus VESA LOCal Bus | |
![]() |
XT Bus 8bit | |
![]() |
ZIP Zig-Zag Inline Package |